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2 millimeter pitch PH connector JST PHR-2-BL compact size with brass copper alloy tin plated contacts

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2 millimeter pitch PH connector JST PHR-2-BL compact size with brass copper alloy tin plated contacts

Flame Retardant Rating : UL94V-0

Pitch : 2mm

colour : 蓝色

Number of Rows : 1

With Wings : 不带翅

Reference Series : PH

Operating Temperature : -25℃~+85℃

Plastic Material : PA66

Number of PINs Per Row : 2

Number of Positions or Pins : 1x2P

Row Spacing : -

With Locker : 不带锁扣

Description : Connector Housing 2 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃

Mfr. Part # : PHR-2-BL

Package : P=2mm

Model Number : PHR-2-BL

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PH CONNECTOR

This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in Surface Mount (SMT) models.

Product Attributes

Brand: JST
Material (Wafer): PA 66, UL94V-0, natural (white/ivory)
Material (Post): Brass/Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Material (Solder tab): Brass, copper-undercoated, tin-plated (reflow treatment)
Certifications: UL Recognized E60389, CSA Certified LR20812, R75087
RoHS Compliant: Yes

Technical Specifications

Model Type	Model No.	Circuits	Dimensions (mm) A	Dimensions (mm) B	Q'ty / Box	Material and Finish	Applicable Wire (mm)	Applicable Wire (AWG)	Insulation O.D. (mm)	Q'ty / reel	Notes
Contact	SPH-002T-P0.5S	-	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	0.05 0.22	3024	0.91.5	8,000	-
Contact	SPH-002T-P0.5L	-	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	0.08 0.22	2824	0.81.5	10,000	Low insertion force type
Contact	SPH-004T-P0.5S	-	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	0.0320.08	3228	0.50.9	-	-
Receptacle Housing	PHR-2	2	2.0	5.8	1,000	PA 66, UL94V-0, natural (white)	-	-	-	-	-
Receptacle Housing	PHR-16	16	30.0	33.8	1,000	PA 66, UL94V-0, natural (white)	-	-	-	-	-
Through-hole Header (Top Entry)	B2B-PH-K-S	2	2.0	5.9	1,000	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-	-
Through-hole Header (Top Entry)	B16B-PH-K-S	16	30.0	33.9	250	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-	-
Through-hole Header (Side Entry)	S2B-PH-K-S	2	2.0	5.9	1,000	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-	-
Through-hole Header (Side Entry)	S16B-PH-K-S	16	30.0	33.9	250	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-	-
Through-hole Header (Top Entry, Low Insertion Force)	B2B-PH-KL	2	2.0	5.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-	(LF)(SN)
Through-hole Header (Top Entry, Low Insertion Force)	B16B-PH-KL	16	30.0	33.9	250	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-	(LF)(SN)
Through-hole Header (Side Entry, Low Insertion Force)	S2B-PH-KL	2	2.0	5.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-	(LF)(SN)
Through-hole Header (Side Entry, Low Insertion Force)	S16B-PH-KL	16	30.0	33.9	250	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-	(LF)(SN)
SMT Header (Top Entry)	B2B-PH-SM4-TB	2	2.0	7.95	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-	(LF)(SN)
SMT Header (Top Entry)	B16B-PH-SM4-TB	16	30.0	35.95	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-	(LF)(SN)
SMT Header (Side Entry)	S2B-PH-SM4-TB	2	2.0	7.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-	(LF)(SN)
SMT Header (Side Entry)	S15B-PH-SM4-TB	15	28.0	33.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-	(LF)(SN)

General Specifications

Specification	Value
Pitch	2.0mm
Current Rating	2A AC, DC (AWG #24)
Voltage Rating	100V AC, DC
Temperature Range	-25C to +85C
Contact Resistance	Initial: 10mmax. After environmental testing: 20mmax.
Insulation Resistance	1,000Mmin.
Withstanding Voltage	800V AC/ minute
Applicable PC board thickness	0.8 to 1.6mm

2004071209_JST-PHR-2-BL_C495693.pdf

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