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Compact low profile connector housing JST ZHR-2 suitable for space saving wire to board applications

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Compact low profile connector housing JST ZHR-2 suitable for space saving wire to board applications

Flame Retardant Rating : UL94V-0

Pitch : 1.5mm

colour : 白色

Number of Rows : 1

With Wings : 不带翅

Reference Series : ZH

Operating Temperature : -25℃~+85℃

Plastic Material : PA66

Number of PINs Per Row : 2

Number of Positions or Pins : 1x2P

With Locker : 不带锁扣

Row Spacing : -

Description : Connector Housing 2 Position 1.5mm Pitch Single Row ZH Series PA66 -25℃~+85℃

Mfr. Part # : ZHR-2

Package : P=1.5mm

Model Number : ZHR-2

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ZH CONNECTOR

The ZH connector is a very compact, low-profile disconnectable crimp-style connector designed for space-saving applications. It features a mounting height of 5.6 mm and a thickness of 3.5 mm. The housing incorporates retention lances for easier insertion, and a dimple at the center of the contact ensures reliable connection with the post. Its distortion-resistant construction and compatibility with ZR insulation displacement connectors make it suitable for various wire-to-board applications.

Product Attributes

Brand: JST
Certifications: UL Recognized (E60389), CSA Certified (LR20812)
RoHS Compliance: Yes

Technical Specifications

Type	Model No.	Circuits	Pitch (mm)	Dimensions (mm) L x W	Q'ty	Material	Finish
Contact	SZH-002T-P0.5	2	0.5	-	13,000/reel	Phosphor bronze	Tin-plated (reflow treatment)
Contact	SZH-003T-P0.5	3	0.5	-	16,000/reel	Phosphor bronze	Tin-plated (reflow treatment)
Housing	ZHR-2	2	1.5	-	1,000/bag	PA 66, UL94V-0	Natural (white)
Housing	ZHR-3	3	1.5	-	1,000/bag	PA 66, UL94V-0	Natural (white)
Housing	ZHR-6(3.0)	6	3.0	-	1,000/bag	PA 66, UL94V-0	Natural (white)
Header (Through-hole)	B2B-ZR	2	1.5	-	2,000/box	Pin: Brass, Wafer: Glass-filled PA 66, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (Through-hole)	B13B-ZR	13	1.5	-	500/box	Pin: Brass, Wafer: Glass-filled PA 66, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (Through-hole, 3.4mm solder tail)	B2B-ZR-3.4	2	1.5	-	2,000/box	Pin: Brass, Wafer: Glass-filled PA 66, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (Through-hole, 3.4mm solder tail)	B13B-ZR-3.4	13	1.5	-	500/box	Pin: Brass, Wafer: Glass-filled PA 66, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (SMT, Side entry)	S2B-ZR-SM2-TF	2	1.5	-	1,000/reel	Pin: Brass, Wafer: PA 6T, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (SMT, Side entry)	S13B-ZR-SM2-TF	13	1.5	-	1,000/reel	Pin: Brass, Wafer: PA 6T, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (SMT, Side entry)	S2B-ZR-SM4A-TF	2	1.5	-	1,000/reel	Pin: Brass, Wafer: PA 6T, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (SMT, Side entry)	S13B-ZR-SM4A-TF	13	1.5	-	1,000/reel	Pin: Brass, Wafer: PA 6T, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (SMT, Top entry)	B2B-ZR-SM4-TF	2	1.5	-	1,000/reel	Pin: Brass, Wafer: PA 6T, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)
Header (SMT, Top entry)	B13B-ZR-SM4-TF	13	1.5	-	1,000/reel	Pin: Brass, Wafer: PA 6T, UL94V-0	Pin: Tin-plated (reflow treatment), Wafer: Natural (ivory)

General Specifications

Specification	Value
Current Rating	1.0 A AC, DC (AWG #26)
Voltage Rating	50 V AC, DC
Temperature Range	-25C to +85C
Contact Resistance	Initial: 20 mmax., After environmental tests: 30 mmax.
Insulation Resistance	500 Mmin.
Withstanding Voltage	500 VAC/minute
Applicable Wire	AWG #32 to #26
Applicable PC Board Thickness	0.6 to 1.2 mm, 1.6 mm

2304140030_JST-ZHR-2_C160375.pdf

Compact low profile connector housing JST ZHR-2 suitable for space saving wire to board applications Images

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