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Standard Type Header Connector JST XAP-04V-1 2.5mm Pitch 4 Circuits PA 66 UL94V-0 White

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Standard Type Header Connector JST XAP-04V-1 2.5mm Pitch 4 Circuits PA 66 UL94V-0 White

Flame Retardant Rating : UL94V-0

Pitch : 2.5mm

colour : 白色

Number of Rows : 1

With Wings : 不带翅

Reference Series : XA

Operating Temperature : -25℃~+85℃

Plastic Material : PA66

Number of PINs Per Row : 4

Number of Positions or Pins : 1x4P

With Locker : 带锁扣

Row Spacing : -

Description : Connector Housing 4 Position 2.5mm Pitch Single Row XA Series PA66 -25℃~+85℃

Mfr. Part # : XAP-04V-1

Package : P=2.5mm

Model Number : XAP-04V-1

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Product Overview

The JST XA Connector High Box Type is a disconnectable crimp style connector designed for 2.5mm pitch applications. It is specifically engineered for use with resin-coated (potted) PC boards, offering a high box type configuration with a mounting height of 19.5mm and a thickness of 6.9mm. This connector ensures reliable electrical connections with high current and voltage ratings, suitable for a wide temperature range.

Product Attributes

Brand: JST
Certifications: UL Recognized E60389, CSA Certified LR20812
RoHS Compliant: Yes

Technical Specifications

Type	Model No.	Circuits	Dimensions (mm) A	Dimensions (mm) B	Material	Q'ty / bag	Notes
Header (High box type)	XMS-02V to XMS-15V	2-15	2.5 to 35.0	-	Glass-filled PA 66, UL94V-0, natural (ivory)	1,000	With a boss / Without a boss
Header (Standard type)	XAP-02V-1 to XAP-15V-1	2-15	2.5 to 35.0	7.3 to 39.8	PA 66, UL94V-0, natural (white)	1,000	Standard type
Header (Retainer mountable type)	XARP-02V to XARP-15V	2-15	2.5 to 35.0	9.8 to 42.3	PA 66, UL94V-0, natural (white)	1,000	Retainer mountable type
Contact	SXA-001T-P0.6	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	8,000 / reel	Applicable wire: AWG #28 to #22, Insulation O.D. (mm): 0.6
Shrouded header (Without a boss)	BH02B-XASK to BH15B-XASK	2-15	2.5 to 35.0	7.5 to 40.0	Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)	400-100	-
Shrouded header (With a boss)	BH02B-XASK-BN to BH15B-XASK-BN	2-15	2.5 to 35.0	10.0 to 42.5	Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)	400-100	-
Shrouded header on radial-tape (Without a boss)	BH02B-XASS-T to BH08B-XASS-T	2-8	2.5 to 17.5	7.5 to 22.5	Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)	1,000-500	Taping specifications
Shrouded header on radial-tape (With a boss)	BH02B-XASS-BN-T to BH08B-XASS-BN-T	2-8	2.5 to 17.5	10.0 to 25.0	Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)	1,000-500	Taping specifications

Specification	Value
Pitch	2.5mm
Current Rating	3A AC, DC (AWG #22)
Voltage Rating	250V AC, DC
Temperature Range	-25C to +85C
Contact Resistance	Initial: 10mmax., After environmental testing: 20mmax.
Insulation Resistance	1,000M min.
Withstanding Voltage	1,000V AC/minute
Applicable PC board thickness	1.6mm

2304140030_JST-XAP-04V-1_C111519.pdf

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