| Sign In | Join Free | My xxjcy.com |
|
Brand Name : SMP21-S1S1-2000-A
MOQ : 500
Card Connection Mode : Push-Push
Operating Temperature : -25℃~+85℃
Packaging Details : SMD
Model Number : SMP21-S1S1-2000-A
Stock : 50000
Delivery Time : 3-5工作日
Height Above Board : 1.9mm
Description : -25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS
This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors provide space savings and improved functionality for system signal transfer.
| Specification | Description | Requirement | Test Condition | Standard |
|---|---|---|---|---|
| Materials - Contact | High performance copper alloy (Phosphor Bronze) | |||
| Finish - Contact Area | Gold over Nickel | |||
| Finish - Solder Tail Area | Gold over Nickel | |||
| Materials - Housing | LCP+30%G.F, UL94V-0 | |||
| Voltage Rating | 500 Volts DC, 250 Volts AC(rms) (per pin) | |||
| Current Rating | 0.5 Amperes DC (per pin) | |||
| Operating Temperature | -25 TO +85 | |||
| Low-Signal Level Contact Resistance | R<100 m | <100 m | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Insulation Resistance | R>1000 M | >1000 M | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 V final for 1 minute. | MIL-STD-202F, Method 301 | |
| Retention Force | 100 Gram (0.98N) minimum (per pin) | 100 Gram (0.98N) minimum | Mate connector with a suitable gauge for each pin at rate of 25 mm/min. | MIL-STD-1344A, Method 2012.1 |
| Vibration | Discontinuity 1.0 microsec. MAX | 1.0 microsec. MAX | Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz (traversed in 1 minute). | MIL-STD-202 Method 201 |
| Durability | 5000 cycles | 5000 cycles | The sample should be mounted in the tester at a rate of 25mm/min. | MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Minimum of 95% solder coverage | Subject test area to flux for 30.5 seconds and then into solder bath at 2705 for 30.5 seconds. | |
| Salt Spray | Oxidation of not more than 5% | Not more than 5% oxidation | Subject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours. | MTL-STD-1344A, Method 1001.1 |
| Temperature Life (Heat Aging) | A. Products in 85 2 for 96 hours, can still be used normally. B. Products in 260 5 or over eight reflow temperature cycles (max 260 ), deformation not more than 0.12 mm. | A. Normal use after 96 hours at 852. B. Deformation < 0.12 mm after reflow. | MTL-STD-202F, Method 108A |
|
|
SHETIME SMP21-S1S1-2000-A Images |