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Brand Name : TF-121-ARP8H30
Packaging Details : SMD
Stock : 790
Operating Temperature : -25℃~+85℃
Height Above Board : 3mm
Connector Type : Connector and Ejector
Model Number : TF-121-ARP8H30
Delivery Time : 1 working day
Description : Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount
Card Connection Mode : Push-Pull
Card Type : MicroSD Card (TF Card)
MOQ : 5
Function: This product is a TF Card connector, designed for data transmission and connectivity.
Application: Suitable for devices requiring TF card storage and interface.
Guan XunPu Electronics Co,Ltd
ROHS Compliant
LCP UL94V-0 BLACK
C5191, Ni UNDERPALTED OVERALL, G/F PALTED ON CONTACT AREA & SOLDER AREA
SUS201, Ni UNDERPLATED OVERALL, G/F PALTED ON SOLDER AREA
| Pin No. | Name | Type | Description | Dimensions (mm) |
|---|---|---|---|---|
| 1 | DAT2 | I/O/PP | DATE LINE (BIT2) | 9.70 x 5.50 |
| 2 | C0/0AT3 | I/O/PP | CARD DETECT DATE LIN (BIT3) | |
| 3 | CMD | PP | COMMAND RESPONSE | |
| 4 | VCC | S | SUPPLY VOLTAGE | |
| 5 | CLX | CLOCK | ||
| 6 | VSS | S | SUPPLY VOLTAGE GROUND | |
| 7 | DAT0 | I/O/PF | DATE LINE (BIT0) | |
| 8 | CD/DAT1 | I/O/PP | DATE LINE (BIT1) |
| Electrical | Specification |
|---|---|
| Contact Resistance | 50 m Ohms Max |
| Dielectric Withstanding Voltage | 500V RMS |
| Insulation Resistance | 1000M Ohms Min |
| Mechanical | Specification |
|---|---|
| Mate Force | 4.5 kg Max |
| Unmate Force | 0.5 kg Min |
| Durability | 1500 Cycles Min |
| Environment | Specification |
|---|---|
| Operating Temperature | -25C to +85C |
| Packaging | Specification |
|---|---|
| Cover Tape Peeling Angle | 165 ~ 180 |
| Cover Tape Peeling Force | 20 ~ 130g |
| Empty/Cover Tape Minimum | 24 PCS Min |
| Leader Tape Minimum | 288mm Min |
| Carrier Tape S-Quantity | 10 Reel/Carton |
| Reel Quantity per Carton | 15000 PCS / CARTON |
| Pieces per Reel | 1500 PCS /REEL |
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XUNPU TF-121-ARP8H30 Images |